Heterogeneous System Component Integration with Nanopackaging
P M Raj
Biomedical Engineering, Electrical and Computer Engineering
Florida International University, Miami USA
Heterogeneous component integration with seamless and 3D connectivity between digital, RF, analog and passive components in a single package with unlimited bandwidth at lower power is the key to realize future electronic and bioelectronic systems. This talk describes the recent nanomaterial and nanoscale component integration breakthroughs that are making heterogeneous integration a reality. The need for high power density and efficiency in mobile, servers, datacenters and automotive electronics is driving advanced packaging technologies for single-stage power conversion close to the active devices. Power passive component (inductors and capacitors) integration is the biggest bottleneck to realize such integrated power modules. Nanomagnetic inductors, high surface area nanocapacitors and innovative 3D component designs will be described. The second part focuses on material and component integration technologies for high-bandwidth 5G-6G communications. Several packaging advances are critical to realize such mm wave to THz communications. These include high-gain antenna arrays in a package with integrated power dividers and combiners, low-loss THz interconnects with substrate-integrated low-loss waveguides, integrated electromagnetic interference isolation structures between power amplifier (PA) and low-noise amplifier (LNA) interconnects and integrated nanomagnetic and nanodielectrics for nonreciprocal and tunable components. The last part of the presentation describes nanopackaging technologies to enable bioelectronic systems with seamless integration between neural recording arrays, active devices and wireless interfaces for ultra-miniaturized wearable and implantable bioelectronic systems. Nanoscale packaging for off-chip interconnections, thermal management, hermetic coatings and encapsulations will also be highlighted.
Dr. P. M. Raj‘s expertise is in packaging of electronic and bioelectronic systems, with emphasis on nanoscale RF, power and bioelectronic components, and active and passive integration in ultrathin embedded modules. He is an Associate Professor in BME and ECE at Florida International University, and Adjunct Professor at Georgia Institute of Technology, Atlanta. He demonstrated several electronic packaging technologies, working with the whole electronic ecosystem, which include several semiconductor, packaging and material, tool, and end-user companies. He co-lead the development of world’s first 3D glass LTE diversity module, and 3D glass antenna-integrated package module for 5G mm wave applications. He developed advanced substrate-integrated power inductors and power capacitors for integrated power modules and voltage regulators. His research led to 330 publications, which include 8 patents. He received more than 25 best-paper awards. He co-advised more than 30 MS and PhD students who are current leaders and technology pioneers in the electronic packaging industry. He is widely recognized for his contributions in integrated passive components and technology roadmapping, component integration for bioelectronic, power and RF modules, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications through IEEE NTC and EPS. He received his PhD from Rutgers University in 1999 in ceramic engineering, ME from the Indian Institute of Science, Bangalore and BS from the Indian Institute of Technology, Kanpur (1993).